Next year's Apple iPhone 14 could be the first phone to use TSMC's new 3DFabric Packaging platform which uses a modular like design and smaller chiplets to take new technologies to market faster.
from PhoneArena https://ift.tt/2Zosn3b
from PhoneArena https://ift.tt/2Zosn3b
Next year's iPhone 14 could be the first smartphone to use TSMC's new packaging platform
![Next year's iPhone 14 could be the first smartphone to use TSMC's new packaging platform]()
Reviewed by Contributer
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September 24, 2021
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