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Intel says it will stuff one trillion transistors into a package by 2030

December 04, 2022 Gadget PhoneArena

Intel announced that it will be able to stuff one trillion transistors into an IC package by 2030.

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Intel says it will stuff one trillion transistors into a package by 2030

Intel says it will stuff one trillion transistors into a package by 2030

Reviewed by Contributer on December 04, 2022 Rating: 5

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